Jointing method for plastic resin molded product

  • Inventors:
  • Assignees: Nippon Gakki Seizo Kk
  • Publication Date: October 18, 1980
  • Publication Number: JP-S55133921-A

Abstract

PURPOSE: To prevent the production of an adhesion layer at a joint portion and to improve the adhesiveness and appearance, by a method wherein a powder, whose composition is equivalent to that of plastic resin molded products to be adhered together, is used, and a capillary phenomenon of a liquid adhesives is utilized. CONSTITUTION: Where plates 1 and 2 are adhered together, adhering surfaces 1a and 2a are previously ground and polished to finish it into a plane having a high precision, the surface so processed being abutted on to each other under a pressing state. A powder 4, whose composition is equivalent to that of the two plates 1 and 2, is then dispersed over a bordering portion 3, of the two abutting surfaces, on the side wherein the appearance is intensively required, a liquid adhesives 5 of a low viscosity being then dropped thereon by means of syringe and the like. The liquid adhesives 5 is solidified after penetrating into a space between the abutting surfaces of the two plates togetherwith a part of the powder due to a capillary phenomenon. A powder hardening portion 6, which remains in a projecting state on the bordering portion 3 of the two plates after hardening and adhering together, is ground and polished to complete the connection. COPYRIGHT: (C)1980,JPO&Japio

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